Fabricating method of semiconductor package structure

ABSTRACT

A fabricating method of a semiconductor package structure is provided. A dielectric layer having a first surface and a second surface is provided. A patterned metal layer has been formed on the first surface of the dielectric layer. An opening going through the first and the second surfaces is formed. A carrier having a third surface and a fourth surface is formed at the second surface. A portion of the third surface is exposed by the opening of the dielectric layer. A semiconductor die having a joining surface and a side-surface is joined in the opening. At least a through hole going through the third and the fourth surfaces is formed. A metal layer having at least a heat conductive post extending from the fourth surface of the carrier to the through hole and disposed in the through hole and a containing cavity is formed on the fourth surface.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional of and claims the priority benefit ofU.S. application Ser. No. 12/915,514, filed on Oct. 28, 2010, nowpending, which claims the priority benefit of Taiwan application serialno. 99122521, filed on Jul. 8, 2010. The entirety of the above-mentionedpatent applications is hereby incorporated by reference herein and madea part of specification.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention generally relates to a package structure and a fabricatingmethod thereof, and more particularly, to a package and the carrierstructure thereof and a fabricating method thereof with demand on highheat conduction performing.

2. Description of Related Art

The purpose of chip package is to provide a chip with an appropriatesignal path, a heat conduction path and structure protection. Thetraditional wire bonding technique usually adopts a leadframe as acarrier of the chip. Along with gradually increasing the bonding pointdensity of a chip, the leadframe is unable to provide a higher bondingpoint density, so that it is replaced by a package substrate with highbonding point density, where the chip is packed onto the packagesubstrate through conductive media such as metal wires or bumps.

In general speaking, an adhesive layer conformed to the chip would bedisposed between the chip and the package substrate. The chip is fixedon the package substrate through the adhesive layer. The heat producedby the chip would be transferred to the package substrate through theadhesive layer so as to conduct heat. When paste, for example a silverepoxy, is used as the material of the adhesive layer, due to the poorthermal conducting rate (less than 20 W/mK), high coefficient of thermalexpansion (CTE) (greater than 30 ppm/K) and poor adhering strength ofthe silver epoxy, so that when the heat produced by the chip istransferred to the package substrate through the adhesive layer, anincreasing thermal resistance is caused by the adhesive layer, whichfurther leads to poor heat conduction and decrease the strength of theadhesive layer and even destroy the adhesive layer when thermal stressoccurs. Hence, how to make the heat produced by the chip moreefficiently transferred to outside has become one of development tasksfor the designers.

SUMMARY OF THE INVENTION

Accordingly, the invention is directed to a semiconductor packagestructure having better heat dissipation efficiency and low CTEproperty.

The invention is also directed to a fabricating method of semiconductorpackage structure for fabricating the above-mentioned semiconductorpackage structure.

The invention provides a semiconductor package structure, which includesa dielectric layer, a patterned metal layer, a carrier, a metal layerand a semiconductor die. The dielectric layer has a first surface and asecond surface opposite to each other and an opening going through thefirst surface and the second surface. The patterned metal layer isdisposed on the first surface of the dielectric layer. The carrier isdisposed at the second surface of the dielectric layer and has a thirdsurface and a fourth surface opposite to each other and at least athrough hole going through the third surface and the fourth surface. Aportion of the third surface and the through hole are exposed by theopening of the dielectric layer. The metal layer is disposed on thefourth surface of the carrier and has at least a heat conductive postand a containing cavity, in which the heat conductive post extends fromthe fourth surface of the carrier to the through hole and is disposed inthe through hole, an end of the heat conductive post protrudes away fromthe third surface of the carrier, and the containing cavity is locatedon the end of the heat conductive post. The semiconductor die isdisposed in the opening of the dielectric layer and located in thecontaining cavity.

In an embodiment of the invention, the above-mentioned semiconductorpackage structure further includes a first adhesive layer disposed onthe second surface of the dielectric layer and located between thedielectric layer and the carrier.

In an embodiment of the invention, the above-mentioned semiconductorpackage structure further includes a protection layer disposed on thepatterned metal layer and covering the patterned metal layer.

In an embodiment of the invention, the above-mentioned semiconductorpackage structure further includes a stress buffer layer disposedbetween the containing cavity and the semiconductor die.

In an embodiment of the invention, the above-mentioned semiconductorpackage structure further includes a second adhesive layer disposedbetween the stress buffer layer and the third surface of the carrier.

In an embodiment of the invention, the above-mentioned semiconductorpackage structure further includes an insulation material layer withhigh heat conductivity disposed on a side-surface of the metal layer faraway from the carrier.

In an embodiment of the invention, the above-mentioned insulationmaterial layer with high heat conductivity includes a diamond-likecarbon film layer or a ceramic material layer.

The invention also provides a fabricating method of semiconductorpackage structure, and the fabricating method includes following steps.A dielectric layer is provided, in which the dielectric layer has afirst surface and a second surface opposite to each other, and apatterned metal layer has been formed on the first surface of thedielectric layer. An opening going through the first surface and thesecond surface of the dielectric layer is formed. A carrier is formed atthe second surface of the dielectric layer, in which the carrier has athird surface and a fourth surface opposite to each other and a portionof the third surface is exposed by the opening of the dielectric layer.A semiconductor die is joined in the opening of the dielectric layer, inwhich the semiconductor die has a joining surface and a side-surface. Atleast a through hole going through the third surface and the fourthsurface of the carrier is formed, in which the joining surface and aportion of the side-surface of the semiconductor die are exposed by thethrough hole. A metal layer is formed on the fourth surface of thecarrier, in which the metal layer has at least a heat conductive postextending from the fourth surface of the carrier to the through hole anddisposed in the through hole and a containing cavity, an end of the heatconductive post protrudes away from the third surface of the carrier,the containing cavity is located on the end of the heat conductive postand the semiconductor die is located in the containing cavity.

In an embodiment of the invention, prior to forming the opening of thedielectric layer, the above-mentioned method further includes: forming aprotection layer on the patterned metal layer, in which the protectionlayer covers a portion of the patterned metal layer; forming a firstadhesive layer on the second surface of the dielectric layer.

In an embodiment of the invention, the above-mentioned method of formingthe opening of the dielectric layer includes a routing process, a punchprocess or a laser process.

In an embodiment of the invention, prior to joining the semiconductordie, the above-mentioned method further includes forming a secondadhesive layer on the third surface of the carrier exposed by theopening of the dielectric layer, in which the second adhesive layer islocated on the joining surface of the semiconductor die.

In an embodiment of the invention, the above-mentioned step of formingthe through hole includes: adhering a thin film over the patterned metallayer, on a portion of the dielectric layer and a top end of thesemiconductor die opposite to the joining surface of the semiconductordie; performing an etching process to form the through hole goingthrough the fourth surface and the third surface of the carrier, inwhich the second adhesive layer is exposed by the through hole;performing a laser drilling process to remove the second adhesive layerand a portion of the thin film so as to expose the joining surface and aportion of the side-surface of the semiconductor die.

In an embodiment of the invention, prior to forming the metal layer, theabove-mentioned method further includes forming a stress buffer layer onthe joining surface and a portion of the side-surface of thesemiconductor die.

In an embodiment of the invention, after forming the metal layer, theabove-mentioned method further includes removing the thin film to exposethe patterned metal layer, a portion of the dielectric layer and the topend of the semiconductor die of the semiconductor die.

In an embodiment of the invention, after joining the semiconductor die,the above-mentioned method further includes forming a stress bufferlayer on the joining surface and a portion of the side-surface of thesemiconductor die, in which the stress buffer layer is located betweenthe second adhesive layer and the semiconductor die.

In an embodiment of the invention, the above-mentioned step of formingthe through hole includes: adhering a thin film over the patterned metallayer, on a portion of the dielectric layer and on a top end of thesemiconductor die opposite to the joining surface of the semiconductordie; performing an etching process to form the through hole goingthrough the fourth surface and the third surface of the carrier, inwhich the second adhesive layer is exposed by the through hole;performing a laser drilling process to remove a portion of the secondadhesive layer and a portion of the thin film to expose a portion of thestress buffer layer located on the joining surface of the semiconductordie and the stress buffer layer located on the portion of theside-surface of the semiconductor die.

In an embodiment of the invention, after forming the metal layer, theabove-mentioned method further includes removing the thin film to exposethe patterned metal layer, a portion of the dielectric layer and the topend of the semiconductor die of the semiconductor die.

In an embodiment of the invention, the above-mentioned method of formingthe metal layer includes plating, physical vapor deposition (PVD),chemical vapor deposition (CVD) or pure vacuum chemical vapourdeposition (PVCVD).

In an embodiment of the invention, after forming the metal layer on thefourth surface of the carrier, the above-mentioned method furtherincludes performing a wire bonding process so that the semiconductor dieis electrically connected to the patterned metal layer through at leasta wire.

In an embodiment of the invention, after forming the metal layer on thefourth surface of the carrier, the above-mentioned method furtherincludes forming an insulation material layer with high heatconductivity on a side-surface of the metal layer far away from thecarrier.

Based on the depiction above, since the semiconductor die of theinvention is disposed in the containing cavity located on an end of theheat conductive post, so that the heat produced by the semiconductor diecan be fast transferred to outside directly through the heat conductivepost and the carrier under the semiconductor die. As a result, thesemiconductor package structure of the invention has a better heatdissipation efficiency.

In order to make the aforementioned and other features and advantages ofthe invention more comprehensible, embodiments accompanying figures aredescribed in detail below.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the invention, and are incorporated in and constitute apart of this specification. The drawings illustrate embodiments of theinvention and, together with the description, serve to explain theprinciples of the invention.

FIG. 1 is a cross-sectional diagram of a semiconductor package structureaccording to an embodiment of the invention.

FIGS. 2A-2H are cross-sectional diagrams of a fabricating method ofsemiconductor package structure according to an embodiment of theinvention.

FIGS. 3-6 are cross-sectional diagrams of semiconductor packagestructures according to a plurality of embodiments of the invention.

DESCRIPTION OF THE EMBODIMENTS

FIG. 1 is a cross-sectional diagram of a semiconductor package structureaccording to an embodiment of the invention. Referring to FIG. 1, in theembodiment, a semiconductor package structure 100 a includes adielectric layer 110, a patterned metal layer 120, a carrier 130, ametal layer 140 and a semiconductor die 150.

In more details, the dielectric layer 110 has a first surface 112 and asecond surface 114 opposite to the first surface 112 and an opening 116,in which the opening 116 goes through the first surface 112 and thesecond surface 114. The patterned metal layer 120 is disposed on thefirst surface 112 of the dielectric layer 110, in which the patternedmetal layer 120 exposes the first surface 112 of a portion of the metallayer 110. In the embodiment, the patterned metal layer 120 can serve asthe bonding pad for a successive wire bonding process. The carrier 130is disposed at the second surface 114 of the dielectric layer 110 andhas a third surface 132 and a fourth surface 134 opposite to the thirdsurface 132 and at least a through hole 136 going through the thirdsurface 132 and the fourth surface 134 (in FIG. 1, only one through hole136 is schematically shown). A portion of the third surface 132 and thethrough hole 136 are exposed by the opening 116 of the dielectric layer110, and the material of the carrier 130 is, for example, metal ornon-metal.

The metal layer 140 is disposed on the fourth surface 134 of the carrier130 and has at least a heat conductive post 142 (in FIG. 1, only oneheat conductive post 142 is schematically shown) and a containing cavity144. In particular, the heat conductive post 142 extends from the fourthsurface 134 of the carrier 130 to and is disposed in the through hole136, and an end of the heat conductive post 142 protrudes away from thethird surface 132 of the carrier 130. The containing cavity 144 islocated on an end of the heat conductive post 142 protruding away fromthe third surface 132 of the carrier 130. The semiconductor die 150 isdisposed in the opening 116 of the dielectric layer 110 and has ajoining surface 152, a top end of the semiconductor die 154, a pluralityof bonding pads 156 and a side-surface 158. The joining surface 152herein faces the third surface 132 of the carrier 130, the top end ofthe semiconductor die 154 and the joining surface 152 are opposite toeach other, and the bonding pads 156 are located on the top end of thesemiconductor die 154. In particular, the semiconductor die 150 of theembodiment is located in the containing cavity 144, in which a portionof the side-surface 158 of the semiconductor die 150 is exposed out ofthe containing cavity 144.

The semiconductor package structure 100 a of the embodiment furtherincludes a first adhesive layer 162 disposed on the second surface 114of the dielectric layer 110 and located between the dielectric layer 110and the carrier 130 for stably fixing the dielectric layer 110 on thecarrier 130. The material of the first adhesive layer 162 is, forexample, epoxy. In addition, in the embodiment, the semiconductorpackage structure 100 a further includes a protection layer 172 and asoldering-free layer 176, in which the protection layer 172 is disposedon the patterned metal layer 120 and covers a portion of the patternedmetal layer 120 for avoiding the patterned metal layer 120 from gettingoxidation to affect the reliability of the successive wire (not shown)bonding. The protection layer 172 preferably is, for example, a bi-metallayer structure, composed, for example, of nickel layer and copper layeror nickel layer and silver layer. The soldering-free layer 176 isdisposed on the patterned metal layer 120 and covers another portion ofthe patterned metal layer 120, in which the soldering-free layer 176 andthe protection layer 172 are substantially co-planar.

The semiconductor package structure 100 a further includes a stressbuffer layer 174, in which the stress buffer layer 174 is disposedbetween the containing cavity 144 and the semiconductor die 150 forincreasing the joining strength between the containing cavity 144 andthe semiconductor die 150 to increase the reliability of thesemiconductor package structure 100 a. In other embodiments, thesemiconductor package structure 100 a can have no stress buffer layer174, that is, the joining surface 152 of the semiconductor die 150 canbe directly disposed at and contact the containing cavity 144 located atan end of the heat conductive post 142. The semiconductor die 150 of thesemiconductor package structure 100 a in the embodiment can beelectrically connected to the protection layer 172 on the patternedmetal layer 120 through at least a wire 190 (in FIG. 1, two wires areschematically shown), in which both ends of the wires 190 arerespectively connected between the bonding pads 156 of the semiconductordie 150 and the patterned metal layer 120.

Since the semiconductor die 150 of the embodiment is disposed in thecontaining cavity 144, in which the containing cavity 144 is located onan end of the heat conductive post 142 protruding away from the thirdsurface 132 of the carrier 130, so that the heat produced by thesemiconductor die 150 can be fast transferred to outside directlythrough the heat conductive post 142 and the carrier 130 under thesemiconductor die 150. In comparison with the prior art where the chip'sheat is transferred to a package substrate through an adhesive layer,the semiconductor package structure 100 a of the embodiment has betterheat dissipation efficiency.

In the depiction above, the structure of the semiconductor packagestructure 100 a of the invention is introduced, but the fabricatingmethod of the semiconductor package structure 100 a of the invention isnot introduced yet. In following, taking the semiconductor packagestructure 100 a of FIG. 1 as an example, a fabricating method of thesemiconductor package structure 100 a is described in details inassociation with FIGS. 2A-2H.

FIGS. 2A-2H are cross-sectional diagrams of a fabricating method ofsemiconductor package structure according to an embodiment of theinvention. Referring to FIG. 2A, according to the fabricating method ofthe semiconductor package structure 100 a of the embodiment, first, adielectric layer 110 is provided. In the embodiment, the dielectriclayer 110 has a first surface 112 and a second surface 114 opposite tothe first surface 112, in which a patterned metal layer 120 located onthe first surface 112 has been formed on the dielectric layer 110, and aprotection layer 172 and a soldering-free layer 176 have been formed onthe patterned metal layer 120. The protection layer 172 and thesoldering-free layer 176 are co-planed, and the protection layer 172covers a portion of the patterned metal layer 120 for avoiding thepatterned metal layer 120 from getting oxidation to further affect thereliability of the successive wire (not shown) bonding. Thesoldering-free layer 176 covers another portion of the patterned metallayer 120. In the embodiment, the method of forming the protection layer172 is, for example, plating, and the protection layer 172 is, forexample, a bi-metal layer structure, composed, for example, of nickellayer and copper layer or nickel layer and silver layer.

Next referring to FIG. 2B, an adhesive layer is formed on the secondsurface 114 of the dielectric layer 110. In the embodiment, the materialof the adhesive layer is, for example, epoxy. After that, a routingprocess, a punch process or a laser process are conducted to form anopening 116 going through the first surface 112 and the second surface114 of the dielectric layer 110 and a first adhesive layer 162.

Further continuing to FIG. 2B, a carrier 130 is formed on the firstadhesive layer 162, in which the first adhesive layer 162 is locatedbetween the dielectric layer 110 and the carrier 130 for stably fixingthe dielectric layer 110 on the carrier 130. In particular, in theembodiment, the dielectric layer 110, the first adhesive layer 162 andthe carrier 130 together form a step-shaped cavity structure C. In moredetails, the carrier 130 has a third surface 132 and a fourth surface134 opposite to the third surface 132, in which the opening 116 of thedielectric layer 110 exposes a portion of the third surface 132 and thefirst adhesive layer 162 is located on the third surface 132.

Then referring to FIG. 2C, a second adhesive layer 164 is formed on thethird surface 132 of the carrier 130 exposed by the opening 116 of thedielectric layer 110, in which the material of the second adhesive layer164 includes silver epoxy. Then, a semiconductor die 150 is joined inthe opening 116 of the dielectric layer 110, in which the semiconductordie 150 has a joining surface 152, a top end of the semiconductor die154, a plurality of bonding pads 156 and a side-surface 158. The joiningsurface 152 faces the third surface 132 of the carrier 130, the top endof the semiconductor die 154 and the joining surface 152 are opposite toeach other, and the bonding pads 156 are located on the top end of thesemiconductor die 154. The second adhesive layer 164 is located betweenthe joining surface 152 of the semiconductor die 150 and the thirdsurface 132 of the carrier 130 for stably fixing the semiconductor die150 on the carrier 130.

Then referring to FIG. 2D, a thin film 180 is adhered on the firstprotection layer 172 and the soldering-free layer 176 over the patternedmetal layer 120, on the first surface 112 of a portion of the dielectriclayer 110, on the top end of the semiconductor die 154 and theside-surface 158 of the semiconductor die 150 and on a portion of thesecond adhesive layer 164. In the embodiment, the thin film 180 is, forexample, a tape.

Then referring to FIG. 2D, an etching process is conducted to form athrough hole 136 (in FIG. 2H, only one through hole 136 is schematicallyshown) going through the fourth surface 134 and the third surface 132 ofthe carrier 130, in which the through hole 136 exposes the secondadhesive layer 164.

Then referring to FIG. 2E, a laser drilling process is conducted toremove the second adhesive layer 164 and a portion of the thin film 180so that the through hole 136 exposes the joining surface 152 and aportion of the side-surface 158 of the semiconductor die 150.

Then referring to FIG. 2F, a stress buffer layer 174 is formed on thejoining surface 152 and a portion of the side-surface 158 exposed by thethrough hole 136 of the semiconductor die 150. Then, a metal layer 140is formed on the fourth surface 134 of the carrier 130, in which themetal layer 140 has at least a heat conductive post 142 (in FIG. 2F,only one heat conductive post 142 is schematically shown) and acontaining cavity 144. In more details, the heat conductive post 142extends from the fourth surface 134 of the carrier 130 to and isdisposed in the through hole 136, in which an end of the heat conductivepost 142 protrudes away from the third surface 132 of the carrier 130.The containing cavity 144 is located on an end of the heat conductivepost 142 protruding away from the third surface 132 of the carrier 130and the semiconductor die 150 is located in the containing cavity 144.In the embodiment, the method of forming the metal layer 140 is, forexample, plating, physical vapor deposition (PVD), chemical vapordeposition (CVD) or pure vacuum chemical vapour deposition (PVCVD).

Then referring to FIG. 2G, the thin film 180 is removed to expose theprotection layer 172 and the soldering-free layer 176 over the patternedmetal layer 120, the first surface 112 of a portion of the dielectriclayer 110, a portion of the first adhesive layer 162 and the top end ofthe semiconductor die 154 and the side-surface 158 of the semiconductordie 150.

Finally referring to FIG. 2H, a wire bonding process is conducted sothat the bonding pads 156 of the semiconductor die 150 are electricallyconnected to the protection layer 172 on the patterned metal layer 120through at least a wire 190 (in FIG. 2H, only two wires areschematically shown). At the time, the semiconductor package structure100 a has been fabricated.

Since in the fabricating method of the semiconductor package structure100 a of the embodiment, the through hole 136 is formed and the secondadhesive layer 164 is removed by performing the etching process and thelaser drilling process, so that the heat conductive post 142 of themetal layer 140 can be formed in the through hole 136 and thesemiconductor die 150 can be disposed in the containing cavity 144. As aresult, the heat produced by the semiconductor die 150 can be fasttransferred to outside directly through the heat conductive post 142 andthe carrier 130 under the semiconductor die 150. In comparison with theprior art where the chip's heat is transferred to a package substratethrough an adhesive layer, the semiconductor package structure 100 a ofthe embodiment has better heat dissipation efficiency.

The process of FIGS. 2A-2H is described as an example only, in which thepartial steps are common techniques in the semiconductor package processtoday. Anyone skilled in the art can adjust, omit or increase possiblesteps according to the real application so as to conform the processrequirement, which is omitted to describe.

It should be noted that the following embodiment uses the componentmarks and partial contents of the above-mentioned embodiment, in whichthe same marks indicate the same or similar components and the sametechnical contents are omitted, and the depiction of the omitted partcan refer to the above-mentioned embodiment, which is not repeated inthe following embodiment.

FIG. 3 is a cross-sectional diagram of a semiconductor package structureaccording to another embodiment of the invention. Referring to FIGS. 1and 3, the semiconductor package structure 100 b of the embodiment issimilar to the semiconductor package structure 100 a of FIG. 1 exceptthat the heat conductive post 142 a of the metal layer 140 a in thesemiconductor package structure 100 b protrudes away from an end of thethird surface 132 of the carrier 130 and is substantially aligned withthe top end of the semiconductor die 154 of the semiconductor die 150.In the embodiment, the side-surface 158 of the semiconductor die 150 iscompletely located in the containing cavity 144, so that the metal layer140 a has a larger area, which increases the heat conduction path of theside edge of the semiconductor die 150 and further advances the heatdissipating effect of the semiconductor package structure 100 b.

FIG. 4 is a cross-sectional diagram of a semiconductor package structureaccording to yet another embodiment of the invention. Referring to FIGS.1 and 4, the semiconductor package structure 100 c of the embodiment issimilar to the semiconductor package structure 100 a of FIG. 1 exceptthat the semiconductor package structure 100 c of FIG. 4 furtherincludes a second adhesive layer 164 a, in which the second adhesivelayer 164 a is located between the stress buffer layer 174 and the thirdsurface 132 of the carrier 130 c so that the semiconductor die 150 canbe more stably fixed on the carrier 130 c. In addition, the carrier 130c of the embodiment has a plurality of through holes 136 c, and aplurality of heat conductive posts 142 c of the metal layer 140 c arerespectively located in the through holes 136 c of the carrier 130 c anddirectly contact a portion of the stress buffer layer 174.

In terms of the process, the semiconductor package structure 100 c ofthe embodiment can adopt roughly the similar fabrication method as thesemiconductor package structure 100 a of the above-mentioned embodiment.In performing the process step shown by FIG. 2C, first, the stressbuffer layer 174 and the second adhesive layer 164 a located on thestress buffer layer 174 and the third surface 132 of the carrier 130 care formed. Next, the process step shown by FIG. 2D is conducted, wherea plurality of through holes 136 c are formed to expose the secondadhesive layer 164 a. Then, the process step shown by FIG. 2E isconducted, where a portion of the second adhesive layer 164 a and aportion of thin film 180 are removed to expose a portion of the stressbuffer layer 174 on the joining surface 152 of the semiconductor die 150and the stress buffer layer 174 located on a portion of the side-surface158 of the semiconductor die 150. After that, the process step shown byFIG. 2F is conducted, where a plurality of heat conductive posts 142 cextending from the fourth surface 134 of the carrier 130 c and locatedin the through holes 136 c are formed. Finally, the process steps ofFIGS. 2G and 2H are sequentially conducted. At the time, thesemiconductor package structure 100 c is almost completed.

FIG. 5 is a cross-sectional diagram of a semiconductor package structureaccording to yet another embodiment of the invention. Referring to FIGS.1 and 5, the semiconductor package structure 100 d of the embodiment issimilar to the semiconductor package structure 100 a of FIG. 1 exceptthat the semiconductor package structure 100 d of FIG. 5 furtherincludes an insulation material layer with high heat conductivity 185,in which the insulation material layer with high heat conductivity 185is disposed on a side-surface of the metal layer 140 far away from thecarrier 130. The insulation material layer with high heat conductivity185 is, for example, a diamond-like carbon film layer or a ceramicmaterial layer. Since the semiconductor package structure 100 d of theembodiment has the insulation material layer with high heat conductivity185, so that it can serve as a bottom insulation of the semiconductorpackage structure 100 d, it also can better meet the heat conductiondemand of the semiconductor package structure 100 d.

FIG. 6 is a cross-sectional diagram of a semiconductor package structureaccording to yet another embodiment of the invention. Referring to FIGS.4 and 6, the semiconductor package structure 100 e of the embodiment issimilar to the semiconductor package structure 100 c of FIG. 4 exceptthat the semiconductor package structure 100 e of FIG. 6 furtherincludes an insulation material layer with high heat conductivity 185,in which the insulation material layer with high heat conductivity 185is disposed on a side-surface of the metal layer 140 far away from thecarrier 130. The insulation material layer with high heat conductivity185 is, for example, a diamond-like carbon film layer or a ceramicmaterial layer. Since the semiconductor package structure 100 e of theembodiment has the insulation material layer with high heat conductivity185, so that it can serve as a bottom insulation of the semiconductorpackage structure 100 e, it also can better meet the heat dissipationdemand of the semiconductor package structure 100 e.

In summary, since the adhesive layer of the invention does notcompletely cover or does not cover (i.e., no adhesive layer) the joiningsurface of the semiconductor die and the semiconductor die is disposedin the containing cavity located on an end of the heat conductive post,so that the heat produced by the semiconductor die can be fasttransferred to outside directly through the heat conductive post and thecarrier under the semiconductor die. As a result, the semiconductorpackage structure of the invention has a better heat dissipationefficiency.

It will be apparent to those skilled in the art that the descriptionsabove are several preferred embodiments of the invention only, whichdoes not limit the implementing range of the invention. Variousmodifications and variations can be made to the structure of theinvention without departing from the scope or spirit of the invention.

What is claimed is:
 1. A fabricating method of semiconductor packagestructure, comprising: providing a dielectric layer, having a firstsurface and a second surface opposite to each other, wherein a patternedmetal layer has been formed on the first surface of the dielectriclayer; forming an opening going through the first surface and the secondsurface of the dielectric layer; forming a first adhesive layer on thesecond surface of the dielectric layer prior to forming the opening ofthe dielectric layer; forming a carrier at the second surface of thedielectric layer, wherein the carrier has a third surface and a fourthsurface opposite to each other and a portion of the third surface isexposed by the opening of the dielectric layer, and the first adhesivelayer is located between the dielectric layer and the carrier for stablyfixing the dielectric layer on the carrier; joining a semiconductor diein the opening of the dielectric layer, wherein the semiconductor diehas a joining surface and a side-surface; forming a second adhesivelayer on the third surface of the carrier exposed by the opening of thedielectric layer prior to joining the semiconductor die, wherein thesecond adhesive layer is located on the joining surface of thesemiconductor die; forming at least a through hole going through thethird surface and the fourth surface of the carrier, wherein the joiningsurface and a portion of the side-surface of the semiconductor die areexposed by the through hole; and forming a metal layer on the fourthsurface of the carrier, wherein the metal layer has at least a heatconductive post extending from the fourth surface of the carrier to thethrough hole and disposed in the through hole and a containing cavity,an end of the heat conductive post protrudes away from the third surfaceof the carrier, the containing cavity is located on the end of the heatconductive post and the semiconductor die is located in the containingcavity; forming a stress buffer layer on the joining surface and aportion of the side-surface of the semiconductor die prior to formingthe metal layer.
 2. The fabricating method of semiconductor packagestructure as claimed in claim 1, wherein prior to forming the opening ofthe dielectric layer, the method further comprises: forming a protectionlayer on the patterned metal layer, wherein the protection layer coversa portion of the patterned metal layer.
 3. The fabricating method ofsemiconductor package structure as claimed in claim 1, wherein themethod of forming the opening of the dielectric layer comprises arouting process, a punch process or a laser process.
 4. The fabricatingmethod of semiconductor package structure as claimed in claim 1, whereinthe step of forming the through hole comprises: adhering a thin filmover the patterned metal layer, on a portion of the dielectric layer anda top end of the semiconductor die opposite to the joining surface ofthe semiconductor die; performing an etching process to form the throughhole going through the fourth surface and the third surface of thecarrier, wherein the second adhesive layer is exposed by the throughhole; and performing a laser drilling process to remove the secondadhesive layer and a portion of the thin film so as to expose thejoining surface and a portion of the side-surface of the semiconductordie.
 5. The fabricating method of semiconductor package structure asclaimed in claim 4, wherein after forming the metal layer, the methodfurther comprises removing the thin film to expose the patterned metallayer, a portion of the dielectric layer and the top end of thesemiconductor die of the semiconductor die.
 6. The fabricating method ofsemiconductor package structure as claimed in claim 1, wherein afterjoining the semiconductor die, the method further comprises: forming astress buffer layer on the joining surface and a portion of theside-surface of the semiconductor die, wherein the stress buffer layeris located between the second adhesive layer and the semiconductor die.7. The fabricating method of semiconductor package structure as claimedin claim 6, wherein the step of forming the through hole comprises:adhering a thin film over the patterned metal layer, on a portion of thedielectric layer and on a top end of the semiconductor die opposite tothe joining surface of the semiconductor die; performing an etchingprocess to form the through hole going through the fourth surface andthe third surface of the carrier, wherein the second adhesive layer isexposed by the through hole; and performing a laser drilling process toremove a portion of the second adhesive layer and a portion of the thinfilm to expose a portion of the stress buffer layer located on thejoining surface of the semiconductor die and the stress buffer layerlocated on the portion of the side-surface of the semiconductor die. 8.The fabricating method of semiconductor package structure as claimed inclaim 7, wherein after forming the metal layer, the method furthercomprises removing the thin film to expose the patterned metal layer, aportion of the dielectric layer and the top end of the semiconductor dieof the semiconductor die.
 9. The fabricating method of semiconductorpackage structure as claimed in claim 1, wherein the method of formingthe metal layer comprises plating, physical vapor deposition (PVD),chemical vapor deposition (CVD) or pure vacuum chemical vapourdeposition (PVCVD).
 10. The fabricating method of semiconductor packagestructure as claimed in claim 1, wherein after forming the metal layeron the fourth surface of the carrier, the method further comprisesperforming a wire bonding process so that the semiconductor die iselectrically connected to the patterned metal layer through at least awire.
 11. The fabricating method of semiconductor package structure asclaimed in claim 1, wherein after forming the metal layer on the fourthsurface of the carrier, the method further comprises forming aninsulation material layer with high heat conductivity on a side-surfaceof the metal layer far away from the carrier.
 12. The fabricating methodof semiconductor package structure as claimed in claim 2, wherein theheat conductive post covers a portion of a side surface of the firstadhesive layer.
 13. The fabricating method of semiconductor packagestructure as claimed in claim 2, wherein the heat conductive post doesnot cover a side surface of the first adhesive layer.
 14. Thefabricating method of semiconductor package structure as claimed inclaim 2, wherein the heat conductive post completely covers a sidesurface of the first adhesive layer.